Pelletization Quality Simulation for Operation Uncertainty of Die-Plate Based on Liquid-Solid-Liquid Coupling Model

Author:

Liu Xiao Feng1,Liu Fu Qiao2,Yu Bao Hai3,Bi Chao1,Zhang Bing1

Affiliation:

1. Beijing University of Chemical Technology

2. Sinopec Beijing Yanshan Company

3. Shenyang Jinfeng Special Cutting Tools Co., Ltd

Abstract

As an important component of large-scale extruder system for polymer material, Die-plate can be regarded as the final determinant for pelletization quality. Flow fluctuation of extruder and die-hole blocking can be summarized as two uncertainties for pelletization quality problem. A Liquid-Solid-Liquid coupling FEM method is presented to simulate factors of temperature distribution, flow distribution and flow rate control. Based on the calculations and mechanism analysis, pelletization quality degree and assessment framework are designed and calculated to analyze the impact of operation uncertainties to final product. With the simulation and evaluation framework, control methods for pelletization quality are discussed for Die-plate design and operation condition settings.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference5 articles.

1. Mendes Filho, A. A. De A, The influence of ECAP die channel geometry on shear strain and deformation uniformity, Materials Science Forum. 584-586 PART 1(2008)145-150.

2. Shixiong Ren, Tao Lu, Shasha Dang, Kuisheng Wang, Numerical simulation of temperature field of die for polypropylene pelletizing under water, Journal of Mechanical Engineering/Jixie Gongcheng Xuebao. 7(2009)274-277, In Chinese.

3. Gupta, Mahesh, Three dimensional simulation of coextrusion in a complex profile die, Annual Technical Conference-ANTEC, Conference Proceedings. 3(2010)1688-1694.

4. Wei Zhang, Liqun Dong, Jun Zhang, Flow field research of Polymer melt in the granulation die, Theory and Research. 34(2008) 1-4, In Chinese.

5. Gupta, Mahesh, Effect of wall slip on the flow in a flat die for sheet extrusion, Annual Technical Conference-ANTEC, Conference Proceedings. 2(2011)1191-1196.

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