“Au (lll)—Cysteine” Complex and its Application in Electro-Less Deposition

Abstract

Auric-cysteine complex[MAu(Cys)4.xH2O,M=K,NH4,Na] was reported in this paper ,and its application in the electro-less plating was studied . By using single factor’s experiments the optimal plating index has been gotten and they are: pH=7~9,[Au]=1.5~3.5 g/L , temperature 40~60 Ċ, supporting ligand 0.1~0.15M and plating time 6~8minutes respectively. Related quality inspection of the plated panels show that the appearance, adhesion power and gold thickness can meet the standard of the modern industry .