Isothermes of Grain Boundary Tension and Grain Boundary Adsorption in Cu-Sn System

Author:

Vaganov Danil V.1,Zhevnenko Sergei1

Affiliation:

1. National University of Science and Technology MISIS, State Technological University Moscow

Abstract

Grain boundary surface tension and surface tension of free surface for pure copper and copper-tin alloys are measured. On the base of these data isothermes of grain boundary tension, free surface tension and isothermes of adsorption are constructed in assumption of a dilute solution.

Publisher

Trans Tech Publications, Ltd.

Subject

Condensed Matter Physics,General Materials Science,Radiation

Reference8 articles.

1. H. Udin, A. J. Shaler and J. Wulff: Metall. Trans. AIME, Feb. (1949), p.186.

2. M.D. Greenberg, J.N. Pryor and W.L. Elban: Mat. Sci. Eng. Vol. 33 (1978), p.63.

3. F.Y. Genin: Acta metal. Mater. Vol. 42, No. 11 (1994), p.3881.

4. D. Josell, F. Spaepen: Acta Met. Mat. Vol. 41, No. 10 (1993), p.3007.

5. S.N. Zhevnenko: Zavodskaya Lab. Vol. 71, №9 (2005), p.44.

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