1. R. Kempers, R. Frizzell, A. Lyons and A.J. Robinson: Proceedings of 2009 ASME InterPACK Conference, IPACK2009-89366, San Francisco, July 8-12, (2009).
2. R. Kempers, P. Kolodner, A. Lyons, and A.J. Robinson: Review of Scientific Instruments, doi: 10. 1063/1. 3193715, (2009).
3. C. V. Madhusudana: Thermal Contact Conductance, Springer-Verlag, New York, (1996).
4. M.M. Yovanovich: IEEE Transactions on Components and Packaging Technologies Vol. 28, (2005) p.182.
5. P. Teertstra: Proceedings of InterPACK 2007, Vancouver, BC, July 8-12, (2007).