Affiliation:
1. Indian Space Research Organization
Abstract
This paper demonstrates a unique application of DIC wherein the structural performance and structural integrity have been evaluated together almost in real-time. The results obtained from the ground level tests, simulating the bonding between the TPS to the base structure of a space crew module, are reported to find the adequacy of two different adhesives prior to actual bonding. The test objective was to characterize the adhesives based on the structural performance (deflection and strain behavior) of the TPS and conduct health monitoring in real-time (i.e. abort the test whenever the TPS fails). The dual objective could be met using DIC in a full-field and non-contact manner, which was essential due to the limitations of the contacting type measurements.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference3 articles.
1. VIC 3D and VICSNAP user manual.
2. D. Swain, J. Philip, S.A. Pillai, Optimized Digital Image Correlation (DIC) for measuring large strain gradient regions, Indian Conference on Applied Mechanics (INCAM) 2013, IIT Madras.
3. H.W. Schrier, J.J. Orteu, M.A. Sutton, Image Correlation for shape, motion and deformation measurement, Springer, (2009).
Cited by
2 articles.
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