Affiliation:
1. General Electric Global Research Center
2. GE GRC
Abstract
This paper discusses SiC JTE design tradeoffs required to maximize device performance while minimizing consumed die area, fabrication cost and maintaining good reliability. Modeling and experimental results are provided.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
8 articles.
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