Development of Precious Metal and its Alloy Sputtering Targets with High Performance

Author:

He Jin Jiang1,Liu Shu Qin1,Luo Jun Feng1,Wang Yue1,Gao Yan1,Xiong Xiao Dong1

Affiliation:

1. GRIKIN Advanced Materials Co.,Ltd

Abstract

High-purity precious metal and its alloy targets make a very important role in semiconductor manufacturing. In this paper, the preparation methods of high performance sputtering targets (including silver, platinum and its alloy, ruthenium materials) for advanced semiconductor manufacturing were introduced. The relationships between deposited film behaviors and sputtering target properties in some applications were also discussed. In order to acquire high quality thin film, the properties of sputtering target such as density, alloy composition homogeneity, grain size and uniformity et al. have to be well controlled by proper fabrication techniques.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference7 articles.

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2. A. Alam, A. Mookerjee, Lattice thermal conductivity of disordered NiPd and NiPt alloys. J Phys- Condens Mat. 18(2006) 4589–4608.

3. K.L. Pey, P.S. Lee, Mangelinck D, Ni (Pt) alloy silicidation on (100) Si and poly-silicon lines, Thin Solid Films, 462(2004) 137-145.

4. B. C Yang, Y. D Hu, H. L Cui, Trend in development and applications of sputtering target materials. Vacuum, 1(2002) 1-4.

5. Z. Y Shang, X Jiang, Y. J Li etc, Sputtering targets used in integrated circuit. Chin. J. Rare. Metals, 4(2005) 475-477.

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