Effects of Wetting Behavior on Gallium Addition in In-Zn Solder Alloy

Abstract

This paper reported the investigation on gallium, Ga addition into In-4.8Zn lead-free solder to improve its wettability performances. The effect of addition of Ga in In-4.8Zn solder alloy was studied. The results show with the addition of 0.5% Ga into the In-4.8Zn composition, the spreading area of In-4.8Zn-0.5Ga solder on copper increase between 35.71 and 43.75 %. Hence, as the spreading area increases, the contact angle decreased from between 22.09 to 39.71 %. Additionally, the addition of Ga as dopant increased the thickness of IMCs layer.