Tensile Stress Analyses through Digital Image Correlation of Single Lap Joints of High Strength Steel and Aluminum Alloy Using Adhesive Bonding

Author:

Bamberg P.A.M.G.P.1,Reisgen Uwe2ORCID,Marx B.2,Barbosa J.D.V.1,Coelho R.S.1

Affiliation:

1. SENAI-CIMATEC

2. RWTH-Aachen University

Abstract

Structural adhesives methods for joining multi material sheets have been focus of studies and researches for the last years. The most common and widely known type of test is the tensile test of single lap joints (SLJ). However, there are opportunities for analyzing the mechanical performance of such method in SLJ with materials of different properties, such as ductile structural aluminum alloys and high strength steels. It’s also known that the stress state of SLJ, when stressed longitudinally, generates secondary forces. One of them is known as cleavage force which initially leads to the failure of bonded joints. The aim of this work is to analyze the stress state of similar and dissimilar materials SLJ submitted to tensile stresses and also the influence of some variables, such as overlap length, adhesive film thickness and adherend yield limit, over the stress strength of the samples. As adherend materials it was selected the structural aluminum alloy AA 5083 H111 and the high strength steel DP600. At the end of this work it is expected to understand the proper stress state of the SLJ when using similar and dissimilar materials, identifying stress concentrators that bring the structure to fail, using the Digital Image Correlation (DIC) method. It was discovered that the yield strength associated with the overlap length highly influences the SLJ strength, by leading it to a close to pure adhesive shear stress state.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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