Effect of TiC Intermediate Layers on the Thermal Conductivity of Copper/Diamond Composites

Abstract

TiC intermediate layers were formed on the surface of diamond particle with reaction of Ti powders in mixed molten NaCl-KCl salts. The copper/diamond composites with TiC-coated diamond particles were fabricated by pressure infiltration. Then the microstructure and thermal conductivity of the obtained copper/diamond composites were studied. The results showed the thermal conductivity of the composites with a density of 5.65 g/cm3reached 514 Wm-1K-1, which is much higher than with uncoated diamond. The TiC layers synthesized on diamond particles is shown to be an effective way to enhance the thermal conductivity of copper/diamond composite.