Influence of Slip Localization on Surface Relief Formation and Grain Boundary Microcrack Nucleation

Author:

Sauzay Maxime1,Evrard Pierre1,Bavard Karine1

Affiliation:

1. CEA Saclay

Abstract

Slip localization is often observed in metallic polycrystals after cyclic deformation (persistent slip bands) or pre-irradiation followed by tensile deformation (channels). To evaluate its influence on surface relief formation and grain boundary microcrack nucleation, crystalline finite element (FE) computations are carried out using microstructure inputs (slip band aspect ratio/spacing). Slip bands (low critical resolved shear stress (CRSS)) are embedded in small elastic aggregates. Slip band aspect ratio and neighboring grain orientations influence strongly the surface slips. But only a weak effect of slip band CRSS, spacing and grain boundary orientation is observed. Analytical formulae are deduced which allow an easy prediction of the surface and bulk slips. The computed slips are in agreement with experimental measures (AFM/TEM measures on pre-irradiated austenitic stainless steels and nickel, copper and precipitate-strengthened alloy subjected to cyclic loading). Grain boundary normal stresses are computed for various materials and loading conditions. A square root dependence with respect to the distance to the slip band corner is found similarly to the pile-up stress field. But the equivalent stress intensity factor is considerably lower. Analytical formulae are proposed for predicting the grain boundary normal stress field depending on the microstructure lengths. Finally, an energy balance criterion is applied using the equivalent elastic energy release rate and the surface/grain boundary energies. The predicted macroscopic stresses for microcrack nucleation are compared to the experimental ones.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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