Sintering Behavior of Silver Particles in Electrode for Multilayer Ceramic Substrate

Author:

Okada Atsuyuki1,Ogihara Takashi2

Affiliation:

1. Daiken Chemical Co., Ltd.

2. University of Fukui

Abstract

Several types of Ag powder were used as electrode paste for a multilayer ceramic substrate. The shrinkage behavior of the silver powders was investigated during the sintering. Bending and cracking were frequently observed on the substrate when coarse powders that show a broad size distribution and aggregation were used. The shrinkage curve of the Ag paste obtained by spray pyrolysis agreed well with that of the substrate. Furthermore, the electrical properties of the Ag paste were also determined. The resistivity of a silver electrode sintered at 900°C was about 2.00×10-6 Ω・cm.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference5 articles.

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2. H. Ochi, S. Segawa, Y. Baba, M. Suehiro, S. Ogura, Manufacture of conductor paste and ceramic multiplayer substrate, Japan patent 3571957, 2 July (2004).

3. H. Ochi, S. Ogura, M. Nishikawa, Conductive paste for filling in via-hole, and ceramic multilayered circuit board using the same, Japan patent 2004-288915, 14 Oct (2004).

4. R. Ueyama, T. Ueyama, K. Koumoto, J. Ceram. Soc. Jpn., 108 (2000), p.769.

5. N. Aoyagi, T. Ookawa, R. Ueyama, N. Ogata, and T. Ogihara, J. Ceram. Soc. Jpn., 112 (2004), p.891. E-mail: ogihara@matse. u-fukui. ac. jp, Fax: +81-776-27-8624.

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