On-Chip Temperature-Control Technology for Silicon Micro-Gyroscope

Abstract

A micro-heater is used inside silicon micro-gyroscope to keep the working temperature of gyroscope constant so as to minimize the effect of environment temperature on performances of gyroscope. The structure of gyroscope package is first given. With a heater inside, the characteristics of gyroscope, such as frequency, coupled vibrations, temperature distribution and thermal equilibrium time, are predicted with the aid of ANSYS, a finite element tool. Finally, surfaces of the package are optimized with anti-radiation shields covering. As a result, when gyroscope is subjected to an ambient temperature of 20°C, the temperature of itself could reach the equilibrium state of about 84°C within 2 minutes with a temperature difference of about 2°C between the anchor and the proof mass. Besides, if ambient temperature increases from -40°C to 80°C, heating power consumption is degraded from 1.27625W to 0.09712W. However, this design needs further improvement to decrease its heating power consumption and equilibrium time.