Development of Thermoelectric Cooling Devices with Graded Structure

Author:

Kohri Hitoshi1,Shiota Ichiro2

Affiliation:

1. Kogakuin University

2. Salesian Polytechnic

Abstract

Every thermoelectric material shows high performance at a specific narrow temperature range. The temperature range with high performance can be expanded by joining the materials with different peak temperature. This is the concept of a functionally graded material (FGM) for thermoelectric materials. Bismuth telluride is the best material for cooling devices at around room temperature. Then we investigated the thermoelectric cooling properties for bismuth telluride with two step graded structure. FGM samples were fabricated by three methods. The first FGM was synthesized by in situ method. The second one was fabricated by joining in a hot-press equipment. The last one was composed by joining with solder. Thermoelectric cooling properties were evaluated by observing the maximum temperature drop to electric current when the high temperature side was kept constant. The large temperature difference was obtained when the proper configuration of thermoelectric materials along the temperature gradient were performed. The coincidence of optimum electrical currents of composing materials is also essential to obtain the high cooling performance.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference10 articles.

1. M. Niino, L. Chen: Proc. 12th International Conference on Thermoelectrics (1993), p.527.

2. H. Kohri, K. Sato, N. Abe, T. Suzuki, I. Shiota and I. A. Nishida: Functionally Graded Materials '95 (1995), p.95.

3. Y. Imai, Y. Shinohara, I. A. Nishida, H. T. Kaibe, K. Sato, H. Kohri and I. Shiota: Functionally Graded Materials '95 (1995), p.101.

4. M. Orihashi, Y. Noda, L. Chen, Y. Kang, A. Moro and T. Hirai: Proc. 16th International Conference on Thermoelectrics (1998), p.379.

5. A. Iwama, H. Kohri and I. Shiota: Materials Science Forum Vol. 423-425 (2003), p.377.

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