Three-Dimensional Texture Analysis

Author:

Mulders J.J.L.1,Day A.P.

Affiliation:

1. FEI Electron Optics

Abstract

Three-dimensional (3D) microscopy is a new and rapidly expanding area. A DualBeam system, with both a focused ion beam (FIB) column and an electron column, is a powerful instrument for imaging and sectioning microstructures to generate a full 3D sample reconstruction. When an electron backscatter diffraction (EBSD) system is attached to the DualBeam, it becomes a unique tool for making 3D crystallographic measurements on a wide variety of materials. Combining the successive removal by FIB, with sequential EBSD maps taken with the electron beam requires clear geometric considerations and a high level of automation to obtain a decent resolution in the third dimension, including positional sub-pixel re-alignment. Complete automation allows controlled sectioning and analysis of a significant volume of material without operator intervention: a process that may run continuously and automatically for many hours. Using a Nova600, a Channel 6 EBSD system and dedicated control software, Aluminium, Nickel and Steel specimens have been examined and volumes with up to 200 slices have been successfully analysed.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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