Design and Thermal Shock Performance of W/Cu Functionally Graded Material used as Plasma Facing Component
Author:
Affiliation:
1. Tsinghua University
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.scientific.net/MSF.423-425.49.pdf
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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2. Mathematical study of an arbitrary-oriented crack crossing the interface of bonded functionally graded strips under thermo-mechanical loading;Theoretical and Applied Fracture Mechanics;2022-02
3. Fabrication of W/Cu Graded Heat-sink Materials by Electroless Plating and Powder Metallurgy;Rare Metal Materials and Engineering;2016-08
4. A dynamic piecewise-exponential model for transient crack problems of functionally graded materials with arbitrary mechanical properties;Theoretical and Applied Fracture Mechanics;2013-08
5. A fracture mechanics problem of a functionally graded layered structure with an arbitrarily oriented crack crossing the interface;Mechanics of Materials;2012-03
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