Creep Deformation and Microstructure of Alloy 617 Foil at High Temperature

Author:

Sharma S.K.1,Choi Jin Won2,Kang K.J.3

Affiliation:

1. Chonnam National University

2. POSCO

3. Chonam National University

Abstract

The present paper reports the results of microcreep tests and microstructure of alloy 617 foils of 100μm thick specimens at 800 and 900 oC in air. Before each test, the specimens were annealed in vacuum at 950 oC for 17 hrs. The dynamic recrystallizations were observed during creep test. The voids and cracks were observed along grain boundaries. The maximum elongation of grains was found at the lowest applied stress along the loading direction. The average grain size decreases from 20 μm to 2 μm as applied stress increases from 48 to 120 MPa at 800 oC and from 50 μm to 5 μm as the applied stress increases from 35 to 60MPa at 900 oC. The steady state creep rates were increased as applied stress increased in all the specimens.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

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Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Characterization of Creep-Damaged Grain Boundaries of Alloy 617;Metallurgical and Materials Transactions A;2013-09-06

2. Grain Boundary Analysis of Crept Alloy 617;MRS Proceedings;2012

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