Effect of Heat Treatment Conditions on Microstructure and Fracture Toughness of a Cast Ti-Al Alloy

Author:

Ha Tae Kwon1,Jung Jae Young2

Affiliation:

1. Gangneung-Wonju National University

2. Pohang University of Science and Technology

Abstract

Ti-45.5Al-2Cr-4Nb-0.4B alloy was cast by vacuum arc melting at high purity Ar atmosphere using high purity sponge Ti, granular Al (99.99%), flake Nb (99.9%), lump Cr (99.9%) and TiB2 (99.5%) and subsequently heat-treated to obtain a couple of microstructures, i.e. lamellar and near γ. The heat treatment consisted of annealing at a high temperature (1200 ~ 1330oC) of different phase fields for 24 hrs and stabilizing at 900oC for 4 hrs followed by air cooling. Fracture toughness was measured on the specimens with different microstructures at room temperature. The value of KQ of specimen with fully lamella structure was obtained as 18.68 MPa √m, much higher than that of specimen with near γ structure (11.84 MPa √m). It was also revealed that the KQ value was decreased as the annealing temperature decreased.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference15 articles.

1. Y. W. Kim: J. Metals, 47 (1995), pp.39-41.

2. R. W. Hayes and B. London: Acta Metall., 40 (1992), p.2167.

3. P. L. Martin, M. G. Mendiratta and H. A. Lipsitt: Metall. Trans., 14A (1983), p.2170.

4. Y. W. Kim and F. H. Rroes: High Temperature Aluminides and Intermetallics, ed. S.H. Wang et al, (Warrendale, PA: TMS, 1990), pp.465-492.

5. E. L. Hall and S. C. Huang : High Temperature Ordered Intermetallics Alloys III, ed. C.T. Liu et. al, (Pittsburgh, PA: Materials Research Society, 1989), pp.693-698.

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