The Bending Forming Mechanism of Copper Alloy by Different Lasers-Reference-Cited by-同舟云学术

The Bending Forming Mechanism of Copper Alloy by Different Lasers

Published:2014-06 Issue: Volume:968 Page:142-145
ISSN:1662-8985
Container-title:Advanced Materials Research
language:
Short-container-title:AMR

Author:

Jiang Su Qin¹,Liu Ai Hui¹,Wang Xiao Xue¹,Chen Zhong¹

Affiliation:

1. Huaiyin Institute of Technology

Abstract

By FEA method, the bending of the copper alloy thin-plates by continuous laser forming (CLF) and pulse laser forming (PLF) was studied. Based on the analysis of dynamic change and steady distribution for the fields of temperature, stress/strain and displacement, the forming mechanism and rule of copper alloy by different laser modes were revealed. The whole deformation of PLF was the additive effect of all impulse action, while CLF mainly was the result of thermal stress. To get the same deformation, laser pulse energy is about 6 times of the continuous laser，CLF is suitable for larger deformation demands, and PLF is more seemly for micro-forming.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Link

https://www.scientific.net/AMR.968.142.pdf

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