The Ways to the Main Problems in the Application of Low Temperature Co-Fired Ceramics Technology (LTCC)-Reference-Cited by-同舟云学术

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The Ways to the Main Problems in the Application of Low Temperature Co-Fired Ceramics Technology (LTCC)

Published:2014-06 Issue: Volume:941-944 Page:551-554
ISSN:1662-8985
Container-title:Advanced Materials Research
language:
Short-container-title:AMR

Author:

Liu Xiao Dong¹,Wang Shao Hong¹,Hou Zhao Xia¹,Zhou Dan¹,Yang Li Qiong¹,Hu Wei Wei¹

Affiliation:

1. Shenyang University

Abstract

As a new promising integrating and packing technology, the low temperature co-fired ceramic (LTCC) technology shows great potential in the microelectronics field and attracts great attentions for the scholars at home and abroad. In this paper, the practical application of LTCC is introduced and the emphasis is focused on the ways to the main problems in the application. As to this point, some advices are also given for the future development.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Link

https://www.scientific.net/AMR.941-944.551.pdf

Reference22 articles.

1. S. Young: Multilayer Ceramic Technologies, in: R.C. Buchaman (Ed. ), Marcel Dekker, New York, 1986, p.403.

2. AIex Beiley, MD Northrop Grumman, W. Foley, et a1: IEEE MTT-S Digest Part, 2(1997), pp.999-1002.

3. Yuehui Wang, Ji Zhou, Jianhong Shen, et a1: Journal of Inorganic Materials, 21(1997), pp.999-1002.

4. Jianhua Shi, Zhenyu Qian: Application and Practice-Component Application. Vol. 12(2009), pp.37-39.

5. Haiwen Liu, Wei Zheng: Microelectronic Devices and Application. Vol. 46(2009), pp.502-508.

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