Reactive Ion Etching Parameter Effect on Aluminum Bond Pad Surface Morphology-Reference-Cited by-同舟云学术

Reactive Ion Etching Parameter Effect on Aluminum Bond Pad Surface Morphology

Published:2014-04 Issue: Volume:925 Page:140-143
ISSN:1662-8985
Container-title:Advanced Materials Research
language:
Short-container-title:AMR

Author:

Palianysamy Moganraj¹,Sauli Zaliman¹,Hashim Uda¹,Retnasamy Vithyacharan¹,Taniselass Steven¹,Ayub Ramzan Mat¹

Affiliation:

1. Universiti Malaysia Perlis (UniMAP)

Abstract

Reactive Ion Etching (RIE) is an important process in fabrication of semiconductor devices. Design Of Experiment (DOE) has been used to study the effect of Reactive Ion Etch (RIE) towards surface morphology of aluminum bond pad. Important RIE factors involved in this experimental study are ratio of Tetrafluoromethane (CF4), Argon gas flow, BIAS, and ICP power. Different combinations of these factors produces different results of surface morphologies which was obtained using Atomic Force Microscopic (AFM). Produced results shows that overall surface roughness of the pad is affected by RIE and DOE offers a better way to optimize the desired outcome.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Link

https://www.scientific.net/AMR.925.140.pdf

Reference9 articles.

1. Hong Xiao, Introduction to Semiconductor Manufacturing Technology, Prentice Hall, 2001, p.328, 93-94, 121, 127, 129-130, 135-136, 141, 55, 156.

2. Henri Jansent, Han Gardeniers, Meint de Boer, Miko Elwenspoek and Jan Fluitman, (1995), A survey on the reactive ion etching of silicon in microtechnology.

3. H. C. W. Lau, C. X. H. Tang, B. P. K. Leung, C. K. M. Lee, and G. T. S. Ho. 2009. A performance tradeoff function for evaluating suggested parameters in the reactive ion etching process. Trans. Sys. Man Cyber. Part A.

4. Hwaiyu Geng, Semiconductor Manufacturing Handbook, McGraw-Hill, 2005, p.3. 2-3. 5, 21. 33-21. 34.

5. Ganesha Udupa and B.K.A. Ngoi, Surface Topography Analysis Of Silicon Wafers by a Chromameter, Precision Engineering Laboratory, School of Mechanical & Production Engineering, Nanyang Technological University.