Residual Stress Measurement with Laser-Optical and Mechanical Methods

Abstract

A new approach in hole-drilling residual stress analysis is described, applying a laser for quasi non-destructive material removal by laser ablation and measuring simultaneously the residual deformation around the hole by means of high-resolution, digital holographic interferometry. To evaluate this technology, experiments measuring well-defined in-plane stresses in curved strip specimen, on experimental bending device based on the European Standard for four-point bending tests, were carried out with the conventional hole drilling and milling technique and the laser-optical technique described.