Affiliation:
1. Università degli Studi di Pavia
Abstract
The use of shape memory alloys (SMA) in an increasing number of applications
in many ¯elds of engineering, such as biomedical engineering, is leading to a growing interest
toward an exhaustive modeling of their macroscopic behavior in order to construct reliable
simulation tools for SMA devices.
In this paper we review a robust three-dimensional model able to reproduce both pseudo-elastic
and shape-memory behaviors and we report numerical studies where it is used for the simulation
of SMA-based biomedical devices.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
6 articles.
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