Affiliation:
1. Beijing Institute of Aeronautical Materials
Abstract
High volume fraction (63vol.%) SiCp/Al composite for electronic packaging fabricated by
pressureless infiltration was characterized by microscopy, physical and mechanical tests. Microscopy
observations and XRD analysis indicated that the composite appeared to be free of porosity and
macroscopically homogeneous, SiC-Al interface was atomic bonding interface with low thermal
resistivity and electrical resistivity, no interfacial reaction products was detected. Examination of the
fracture surfaces of the composites revealed that the cracks passed through the SiC particles and Al
matrix, no debonding of SiC-Al interface was observed. The fracture mode indicated that the bonding
between SiC-Al was sufficient strong. The properties of the composite were noted for its ultrahigh
thermal conductivity of 235W/m·K and specific modulus (79.9×105m), low coefficient of thermal
expansion (7.2×10-6/K) and density of 2.99g/cm3. The advantages of the composite over traditional
materials used as the electronic packages for aerospace applications were analyzed.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
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