Development of CSP® Processed High Strength Pipe Steels

Author:

Reip C.-P.1,Hennig W.,Kempken J.,Hagmann R.

Affiliation:

1. SMS Siemag Aktiengesellschaft

Abstract

The CSP thin-slab technology (Compact Strip Production) provides a highly developed technical process for hot strip grades at low production costs. CSP combines the process stages of casting and rolling, which are discontinuous in the conventional process. This allows advantages to be achieved in terms of investments, energy consumption and operating costs. This paper describes the development work in progress, using the example of API steel grades. Key aspects of hot strip production such as alloying strategy, casting conditions, pass schedule design and the course of cooling are discussed and the resulting range of material properties is outlined. It can be demonstrated that CSP-produced hot strips feature very good toughness at low temperatures and may even allow applications which call for sour gas resistance.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference7 articles.

1. F.P. Pleschiutschnigg, J. Schwellenbach, T. Schreiter, P. Meierling, E. Wosch, L. Parschat and S. Feldhaus: Optimized linking of steelmaking and CSP for high-quality hot strip and high productivity, Paper presented at the CSM Annual Meeting, Beijing, China, October 31 to November 2, (2001).

2. P. Heinrich, W. Hennig, G. Kneppe and J. I. Larretxi: stahl und eisen Vol. 123 (2003) Nr. 3, p.47.

3. W. Bald, G. Kneppe, D. Rosenthal and P. Sudau: Innovative technologies for strip production, Paper presented at the 5th World Steel Conference, London, Great Britain, March 1 to 2, (1999).

4. W. Hennig, F. Kueper, F.P. Pleschiutschnigg and E. Thomanek: CSP - the status and latest innovation of the thin slab casting technology, Paper presented at the 3 rd European Conference on Continuous Casting, Madrid, Spain, October 20 to 23, (1998).

5. R. Kaspar: steel research Vol. 74 (2003) No. 5, p.318.

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