Diffusion Controlled Grain Boundary and Triple Junction Wetting in Polycrystalline Solid Metal

Abstract

Grain boundary liquid grooving process takes place during the contact of solid phase with the melt. The liquid bismuth network formation along grain boundaries (GBs) and triple junctions (TJs) was investigated in copper polycrystalline samples. The in situ experimental observation technique of Bi penetration through the Cu plate was used. The temperature dependencies of GB and TJ effective penetration depths were determined. The effect of the GB and TJ diffusion on the liquid channels growth mechanism was discussed.