Interface Controlled Diffusional Creep of Cu + 2.8 at.% Co Solid Solution

Abstract

High-temperature creep experiments were performed on a Cu-2.8 ат.% Co solid solution. Cylindrical foils of 18 micrometers thickness were used for this purpose. Creep tests were performed in a hydrogen atmosphere in the temperature range of about from 1233 K to 1343 K and at stresses lower than 0.25 MPa. For comparison, a foil of pure copper and Cu-20 at.% Ni solid solution were investigated on high temperature creep. Measurements on the Cu foil showed classical diffusional creep behavior. The activation energy of creep was defined and turned out to be equal 203 kJ/mol, which is close to the activation energy of bulk self-diffusion of copper. There was a significant increase in activation energy for the Cu-20 at.% Ni solid solution. Its activation energy was about 273 kJ/mol. The creep behavior of Cu-Co solid solution was more complicated. There were two stages of diffusional creep at different temperatures. The extremely large activation energy (about 480 kJ/mol) was determined at relatively low temperature and a small activation energy (about 105 kJ/mol) was found at high temperatures. The creep rate of Cu-Co solid solution was lower than that of pure copper at all temperatures. In addition, the free surface tension of Cu-2.8 ат.% Co was measured at different temperatures from 1242 K to 1352 K. The surface tension increases in this temperature range from 1.6 N/m to 1.75 N/m. There were no features on the temperature dependence of the surface tension.