Wetting Layer and Formation of Metal - Semiconductor Interface

Author:

Plusnin Nikolay I.1

Affiliation:

1. Institute for Automation and Control Processes, Russian Academy of Sciences 5 Radio st, Vladivostok, Russian Federation

Abstract

A wetting layer with a nanophase structure was detected and identified before the first bulk phase during the formation of the metal-silicon interface by vapor-phase deposition at room temperature of the substrate. This became possible due to the developed technique for complex analysis of the structural-chemical state of the surface/ interface with help of Auger electron spectroscopy and electron energy loss spectroscopy, and also due to the method of physical vapor deposition at low temperature of vapor. The discovery this wetting layer and stage of its formation fundamentally changes the approach to the formation of contact between metal and silicon.

Publisher

Trans Tech Publications, Ltd.

Subject

Condensed Matter Physics,General Materials Science,Radiation

Reference7 articles.

1. L.J. Brillson, The structure and properties of metal-semiconductor interfaces, Surf. Sci. Rep. 2 (1982) 123–326.

2. H. H. Weitering, Epitaxial metal-semiconductor interfaces. Materials Science and Engineering: B, 14 (1992) 281-290.

3. V. G. Lifshits, Electronic spectroscopy and atomic processes on the silicon surface, Ed. S. M. Repinsky, Science, Moscow, 1985 (RU).

4. N. I. Plusnin, Atomic-Scale AES-EELS Analysis of Structure-Phase State and Growth Mechanism of Layered Nanostructures, Advances in Materials Physics and Chemistry. 6 (2016) 195- 210.

5. N.I. Plusnin, A. P. Milenin, V. M. Ilyashenko, V. G. Lifshits, Elevated Rate Growth of Nanolayers of Cr and CrSi2 on Si (111), Phys. Low-Dim. Str., 9/10 (2002) 129-146.

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