Ni Grain Boundary Diffusion in Cu-Co Alloys

Abstract

The influence of Co as an alloying element on grain boundary diffusion (GBD) in Cu attracts particular interest due to anomalous GBD of Co in Cu. Ni as a neutral to Co and Cu element was chosen for GBD study. The triple products of Ni GBD in Cu and Cu-Co alloys (with concentration up to 2.9 wt. %) were determined in temperature range 500 – 700 °C by X-ray microprobe analysis. It was shown, that in spite of some scattering the triple product does not depend on Co concentration at all temperatures of experiments. From the obtained results it follows that Co does not change the GB structure.