Effect of Interfaces and Cr Diffusion on Stabilizing Cu Conductivity in Nb<sub>3</sub>Sn-Strands-Reference-Cited by-同舟云学术

Effect of Interfaces and Cr Diffusion on Stabilizing Cu Conductivity in Nb₃Sn-Strands

Published:2013-02 Issue: Volume:334-335 Page:241-246
ISSN:1662-9507
Container-title:Defect and Diffusion Forum
language:
Short-container-title:DDF

Author:

Popova E.N.¹,Deryagina I.L.¹,Polikarpova M.V.²,Novosilova D.C.²,Vorobyova A.E.²

Affiliation:

1. Russian Academy of Sciences

2. Institute of Inorganic Materials

Abstract

The structure of high-purity copper and stabilizing copper of Cr-plated Nb3Sn-strands with different RRR (residual resistance ratio) values has been studied. Cr diffusion into peripheral layers of stabilizing Cu has been revealed. The variations of RRR and Cr content in Cu at annealing have been estimated. It is demonstrated that an additional drop of RRR may be caused by oxygen diffusion from Cr coating obtained by electroplating. Optimal regimes of the diffusion annealing of Cr-plated Nb3Sn-strands for ITER (International Thermonuclear Experimental Reactor) have been determined.

Publisher

Trans Tech Publications, Ltd.

Subject

Condensed Matter Physics,General Materials Science,Radiation

Link

https://www.scientific.net/DDF.334-335.241.pdf

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