Research on the Package of High Voltage SiC JBS-Reference-Cited by-同舟云学术

Research on the Package of High Voltage SiC JBS

Published:2015-01 Issue: Volume:713-715 Page:1038-1041
ISSN:1662-7482
Container-title:Applied Mechanics and Materials
language:
Short-container-title:AMM

Author:

Chen Gang,Li Ya Nan¹,Wang Lin²,Liu Ao²,Bai Song²,Li Dong Hua¹,Zhang Qing Meng

Affiliation:

1. Jinan Semiconductor Institute

2. Nanjing Electronic Device Institute

Abstract

According to the application of the high voltage SiC devices, studying the package of three kinds of SiC dies with different metals. Experiments show that all die wire bonding and shear strength measurement up to standard, and provide three kinds of packages for different applications, at the same time, filling the needs of producing. The purpose of the shear strength test is to determine the integrity of materials used to attach SiC die to package substrates.

Publisher

Trans Tech Publications, Ltd.

Link

https://www.scientific.net/AMM.713-715.1038.pdf

Reference5 articles.

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