Non-Destructive 3-D Determination of Interior Stresses
Author:
Affiliation:
1. National Kaohsiung University of Applied Sciences
2. University of Southampton
3. Stress Photonics Inc.
4. University of Wisconsin
Abstract
Publisher
Trans Tech Publications, Ltd.
Link
https://www.scientific.net/AMM.70.476.pdf
Reference13 articles.
1. W. Weldman, T.G. Ryall and R. Jones, On the determination of stress components in 3-D from thermoelastic data,: Computers and Structures, Vol 36 (1990), pp.553-557.
2. Y. Murakami and M. Yoshimura, Determination of all stress components from measurements of the stress invariant by the thermoelastic stress methods,: International Journal of Solids and Structures, Vol 34 (1997), pp.4449-4461.
3. X.L. Gao and R.E. Rowlands, Hybrid method for stress analysis of finite three-dimensional elastic solids,: International Journal of Solids and Structures, Vol 37 (2000), pp.2727-2751.
4. N. Sathon and J. M. Dulieu-Barton, Evaluation of sub-surface stresses using thermoelastic stress analysis,: Applied Mechanics and Materials, Vol 7-8 (2007), pp.153-158.
5. J.R. Lesniak, D.J. Bazile, B.R. Boyce, G. Hohenwarter, M.J. Zickel, M. Hinders, C.S. Welch and D. Johnson: A Stress Imager Integrating Thermoelastic and Photoelastic Stress Analysis - Development of an Automated Grey Field Polariscope, NASA final report, Stress Photonics Inc. Madison, WI (2000).
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Stress analysis of a pinned wood joint by grey-field photoelasticity;Composites Part B: Engineering;2014-05
2. Full-Field Thermoelastic Stress Analysis of a Finite Structure Containing an Irregularly-Shaped Hole;Experimental Mechanics;2013-11-13
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3