Finite Element Stress Analysis of Adhesive T-Joint with Crack in Fluidization Bed

Author:

Nor A.1,Afendi Mohd1ORCID,Abdul Majid M.S.2,Izzawati Basirom1,Nurhashima S.1,Abdullah A.R.1

Affiliation:

1. Universiti Malaysia Perlis

2. Universiti Malaysia Perlis (UniMAP)

Abstract

In this study, adhesive T-joint with crack in urea granulator fluidization bed was analyzed by finite element (FE) analysis. Objectives of this project were to examine a series of adhesively bonded T- joints with crack under mode I loading, to evaluate stress analysis of adhesive T-joint with crack at top and bottom and to identify the effective bond thickness. The path was drawn in ANSYS at the top and bottom of adhesive from side view to find which part has higher stress. The result of both paths top and bottom analysis shows the stress distribution always higher at both edges. So, the crack was inserted at interface edges and the stress distribution was evaluated. From interface edges stress distribution result of top and bottom, it shows that bottom edge has higher stress compare with top edge. The failure load analysis will compare with other analysis and experiment result. It is found that adhesive T-joint with 1.5mm is the best thickness for granulator fluidization bed application because always has higher failure load.

Publisher

Trans Tech Publications, Ltd.

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3