Femtosecond Ti:Sa Laser Processing of Silica

Abstract

The result of direct ablation of silicon by an 800 nm Ti:Sa femtosecond laser pulses are presented. Obtained slice of silicon with submicron roughness with tilt focused femtosecond laser pulses. Yaw cut more due to mechanical vibrations of the entire installation on a pneumatic table, but not the physics of the ongoing process. During processing, possibly thinning the silicon sample from the opposite edge (sharpening) to submicron values ​​(tens of nanometers).