Determination of the SSM Processing Window

Author:

Brollo Gabriela Lujan1,Zoqui Eugênio José1ORCID

Affiliation:

1. University of Campinas

Abstract

Identification of critical temperatures is paramount for semisolid processing. Application of the principles of differential calculus to identify these temperatures on semisolid transformation curves allows the semisolid metal (SSM) processing window to be determined. This paper synthesizes and organizes a methodology that can be used to this end, namely the differentiation method (DM). Examples are given of the application of the method to 356, 355, and 319 aluminum alloys, which are commonly used in SSM processing, and the results are compared with those of numerical simulations performed with Thermo-Calc® (under the Scheil condition). The DM is applied to experimental differential scanning calorimetry (DSC) heat-flow data for cooling and heating cycles under different kinetic conditions (5, 10, 15, 20, and 25 °C/min). The findings indicate that the DM is an efficient tool for identifying critical points such as the solidus, liquidus, and knee as well as tertiary transformations. The results obtained using the method agree well with those obtained using traditional techniques. The method is operator-independent as it uses well-defined mathematical/graphical criteria to identify critical points. Furthermore, the DM identifies an SSM processing window defined in terms of a higher and lower temperature for rheocasting or thixoforming operations (TSSML and TSSMH) between which the sensitivity is less than 0.03 °C-1 and, consequently, the process is highly controllable. This DM has already been published in a partial and dispersed way in different works in the past and the aim here is to present it in a more cohesive and didactic way, synthesizing the presented data and comparing them.

Publisher

Trans Tech Publications, Ltd.

Subject

Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics

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1. Alloys for semisolid processing;Reference Module in Materials Science and Materials Engineering;2023

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