Growth and Characterization of Vapor Deposited Polyimide Thin Films

Author:

Chu Fu Tong1,Li, Chuan1,He Li Jun1,Liu Xing Zhao1

Affiliation:

1. University of Electronic Science and Technology of China

Abstract

In this paper, we report on the preparation and characterization of polyimide (PI) thin films through vapor deposition polymerization (VDP). PI thin films were formed by vapour co-deposition of the precursor monomers pyromellitic dianhydride (PMDA) and 4,4-oxydianiline (ODA) following a thermal treatment at a temperature of over 300°C. The effects of the polymerization temperature on the characterization of PI films were investigated using scanning electron microscopy and Fourier transform infrared spectroscopy. The results showed that the deposited polyamic acid (PAA, a precursor of polyimide) with imidization in the temperature interval of 300-400°C are smooth, uniformly thick and form without shrinkage.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference7 articles.

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3. E. Spassova, G. Danev, E. Venkova: J Inf. Rec. Mater. Vol. 14 (1986), p.119.

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5. V. Malba, V. Liberman, and A. F. Bernhardt: J. Vac. Sci. Technol. A. Vol. 15 (1997), p.844.

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