Research on Particle Flow Erosion Precision Electroforming Technology

Author:

Dai Nai Chang1,Yu Sheng Dong2

Affiliation:

1. Zhejiang Industry and Trade Vocational College

2. Wenzhou Vocational and Technical College

Abstract

t is possible to get electroforming deposit with numerous special functions by adoption of traditional electroforming technique, but in which there are defects such as uneven electroforming deposit and unstable performance, etc. In order to enhance the quality and speed of electroforming deposit, this article has proposed the particle flow erosion precision electroforming technology, particle flows such as huge amount of micro glass bead is used in the process of electro-deposit for erosion of electroforming deposit surface, so that micro glass beads continuously abrade and impact cathode surface. As indicated in electroforming test of metallic nickel, in comparison with traditional electroforming technology, particle flow erosion precision electroforming technology can effectively change the microscopic structure of electroforming deposit, refine grain and realize evener distribution of grains, so as to reduce the diffracted intensity of all crystal faces and enhance mechanical property of electroforming deposit.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference8 articles.

1. Yu,S.D.; Zh,D.; Li, X.L.; Qu,N.S.; Zh, Zengwei. Study on Abrasive Polishing Assisted Precision Electroforming Using Orbital Movement Cathode, Electric Processing and Mold, first edition of 2009, 32-35.

2. Zh, Z.W.; Zh, D. Study on New Electroforming Technology of Abrasive Hard Particles, China Mechanical Engineering. 2006, 17 (1): 60-63.

3. Yang, Y.X. X-ray Diffraction Analysis [M], Shanghai, Shanghai Jiao Tong University Press, (1994).

4. Li,X.L.; Zhu,D.; Zhu Z.W. A Study on Abrasion-Assisted Electrodeposition of Bright Nickel[J]. Advanced Materials Research, 2008, 53: 393-396.

5. Zhu,D.; Qu,N.S.; Chan K.C.; Development of joint electroforming technology[J]. Journal of materials processing technology, 1997, 63(1): 844-847.

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