Study on Parameters Optimization in Ultra-Precise Processing of Germanium Substrate

Abstract

To improve efficiency in ultra-precision lapping germanium (Ge) substrate, a new ultra-precise process technology is introduced in this paper. Two steps ultra-precise process were semi bonded abrasive lapping in rough machining, and CMP process in finish machining. A good surface quality workpiece was obtained in semi bonded abrasive lapping process efficiently. Several machining parameters were compared and applied. After CMP process, the mirror-like surface of Ge substrate was obtained.