The Development and Research of the Three-Dimensional Simulation System of the Garments CAD-Reference-Cited by-同舟云学术

The Development and Research of the Three-Dimensional Simulation System of the Garments CAD

Published:2012-02 Issue: Volume:155-156 Page:157-161
ISSN:1662-7482
Container-title:Applied Mechanics and Materials
language:
Short-container-title:AMM

Author:

Yang Li Na¹

Affiliation:

1. Shandong Polytechnic University

Abstract

The development and research of three-dimensional (3D) simulation system of the garments CAD (Computer Aided Design) will change the traditional graphic design concepts and design methods, which will develop from two-dimensional (2D) to 3D. It means to build a comprehensive calculating methodology for forming real garments simulation system on the computer. Combining with the advanced CAD technology and technical works of Chinese garments industry will greatly improve the level of the sustainable development and intelligentialization of the software, and will accelerate the technical upgrade of modern garments industry and push the rapid development of national economy.

Publisher

Trans Tech Publications, Ltd.

Link

https://www.scientific.net/AMM.155-156.157.pdf

Reference8 articles.

1. F.F. Zheng: Three-dimensional Parametric Standard Parts Research and Implementation. Journal of Computer-Aided Design & Computer Graphics. 2005, 11 (3), pp.218-220.

2. L.Y. Li, H.Z. Zhang and Q.R. Han: Garment CAD Theory and Application, (China Textile Press, China, 2004, 8 (4), pp.437-440.

3. B.Z. Tan, B.Y. Bang and C.Z. Chen: Based on object-oriented group technology CAD systems Research. Journal of Computer-Aided Design & Computer Graphics. 2008, 11 (5), pp.43-44.

4. X.X. Meng: Parametric design study, Journal of Computer-Aided Desi, 2007, 11 (5), pp.62-69. X.X. Meng: Parametric design study, Journal of Computer-Aided Design & Computer Graphics. 2009 (11), pp.1087-1090.

5. D.P. Zuo, Z.W. Huang: Parameters of the Garment structure of CAD research. Journal of Beijing Institute of Clothing Technology, 2003. 6 (1). ), pp.187-189.

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