Effects of Negative Bias on the Structure of Ti Film and its Adhesiveness to the Base by Plasma

Abstract

Ti film on AISI 201 was prepared by plasma. The film was characterized and analyzed by using a variety of analytical techniques, such as XRD, SEM and universal test machine. Ti films were deposited on AISI 201 stainless steel substrate, it was found that of Ti film has a different microstructure in various negative bias. And film density is connected with bias. When bias rose from the 15V to 100V, the film density increased from 3.82 g/cm3 to 4.28 g/cm3. After bias rose from the 100V to 180V, film density decreased from 4.28 g/cm3 to 4.13g/cm3. And also, due to the microstructural changes, the adhesiveness of Ti films at the AISI 201 increased from 1.16 MPa to maximum of 3.87 MPa, and then decreased. There is a similar maximum value of approximately 7.53 MPa at the AISI 304.