Abstract
The cure kinetics for bisphenol A epoxy resin (BPAER) modified by liquid crystalline Sulfonyl bis(4,1-phenylene)bis[4-(2,3-epoxypropyloxy)benzoate](p-SBPEPB), with3-methyl-tetrahy drophthalic anhydride (MeTHPA) as a curing agent, were investigated by nonisothermal differential scanning calorimetry (DSC) method. The effect of the different liquid crystalline contents and activation energy (Ea) on curing reaction were discussed. The glass transition temperature (Tg) and mechanical property were charactered, The results show that the better content is about 10wt%.
Publisher
Trans Tech Publications, Ltd.