Affiliation:
1. Dalian University of Technology
Abstract
The growth behaviors of intermetallic compound (IMC) layers in soldered and diffusion
bonding Sn/Cu joints and the effects of magnetic field have been investigated. The results indicate
that, without high magnetic field, the growth behaviors of these two IMC layers are similar in the
aging except the initial morphologies. However, the morphologies and crystal orientations of these
two IMC layers have changed after being aged in high magnetic field.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
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