The Effects of Rare Earth on the Hot Pressing of Cu-Sn-TiH2 Bonded Diamond Composites

Author:

Yu Yi Qing1,Tie Xiao Rui1,Li Yuan1,Xu Xi Peng1

Affiliation:

1. Huaqiao University

Abstract

The present study was undertaken to examine the effects of rare earth (RE) in hot pressing of Cu-Sn-TiH2-bonded diamond composites. Two kinds of composite specimens – with RE and without RE – were fabricated. As an additive to the Cu-Sn-TiH2 bond matrix, the RE was used in the form of misch-metal. The hardness and transverse rupture strength (TRS) of the specimens were measured. SEM and EDS were used to analyze the fracture surfaces of the specimens. Both hardness and TRS of the specimens with RE were found to be higher than the specimens without RE. SEM observations indicated that the pop-outs of diamonds on the fracture surface of the segments without RE are more than the specimens with RE. But more diamonds were fractured on the fracture surface of the segments with RE.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference8 articles.

1. K. Janusz: Industrial Diamond Review, Vol. 51 (1991), p.27.

2. Y.K. Wu and Q. Yu: Proceedings of the 1997 International Conference on Powder Metallurgy and Particulate Materials Part 1 (Metal Powder Industries Federation Princeton, USA, 1997).

3. E. Levin and E.Y. Gutmanas: Journal of Materials Science Letters, Vol. 9 (1990), p.726.

4. X.P. Xu and W.D. Huang: Journal of Rare Earth, Vol. 18 (1997), p.25.

5. Y.Q. Yu and X.P. Xu: Key Engineering Materials, Vol. 250 (2003), p.60.

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3