The Influence of Surfactant CTAB on the Microstructure and Material Properties of Nickel Microelectroforming-Reference-Cited by-同舟云学术

The Influence of Surfactant CTAB on the Microstructure and Material Properties of Nickel Microelectroforming

Published:2007-12 Issue: Volume:364-366 Page:346-350
ISSN:1662-9795
Container-title:Key Engineering Materials
language:
Short-container-title:KEM

Author:

Chen Yann Cheng¹,Kuo Sheng Lung²,Lee Jeou Long³,Ke Shih Tsung⁴,Wong Chia Hao²,Ger Ming Der⁴

Affiliation:

1. National Taipei University of Technology

2. National Chin-Yi Institute of Technology

3. Lunghwa University of Science and Technology

4. National Defense University

Abstract

The influence of surfactant CTAB (cetyl trimethyl ammonium bromide) on electrodeposited nickel layer has been investigated in this research. Our result shows that CTAB added in the electrolysis bath can effectively remove the hydrogen to obtain a smoother nickel layer. The effect of CTAB on the surface roughness is also significant. It may be ascribed to the adsorption of CTAB on the electrode surface which results in a hindering effect in the electrodeposition process. Increasing the concentration of CTAB, the grain size of nickel deposit was reduced and the microhardness of the nickel deposit was therefore improved. The hardness of the metal layer can be promoted to 450 Hv when 300 ppm CTAB is added.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.scientific.net/KEM.364-366.346.pdf

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