Affiliation:
1. Taiyuan University of Technology
2. North University for Nationalities
Abstract
Sputtering rate Sr was proposed as an alternative parameter instead of sputtering yield Y
to calibrate the sputtering ability of the target, defined as the mass loss of the target per unit time
and sputtering current. The approach is more reliable for glow discharge processes since the intense
backscattering effect was taken into consideration. The effects of processing parameters on Sr were
investigated through orthogonal test, the results indicated that target temperature affects Sr
obviously, and among the discharge parameters, the target voltage and discharge pressure were the
governing factors. Through regression analysis, the sputtering rate Sr was expressed as a function of
sputtering voltage and discharge pressure which could be used to evaluate or predict the real output
of the sputtering target.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
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