Influence of Grain Boundary Properties on Microcracking of AlN in Sliding Test
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Published:2006-08
Issue:
Volume:317-318
Page:441-444
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ISSN:1662-9795
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Container-title:Key Engineering Materials
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language:
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Short-container-title:KEM
Author:
Kobayashi Yoshimasa1,
Hayase Toru1,
Yamada Naohito1
Abstract
Grain boundary microcracking in sliding test using a silicon pin was evaluated on several
kinds of AlN to investigate the behavior of damage generation and the influence of material properties
on it. The grain boundary fracture toughness (KIC
gb
) was estimated from a percentage of the
intergranular fracture as a grain boundary property for each specimen. KIC
gb
was greatly influensed by
an amount and kinds of additives. After the sliding test, silicon debris accumulation and grain
boundary microcracking of AlN were observed at the wear traces on the surface of AlN. The density
of grain boundary microcracks increased linearly with increasing the contact load. Empirical
relationship indicated that its density depended on KIC
gb
and the AlN grain size, and decreased mainly
with increasing KIC
gb. The density of grain boundary microcracks greatly degreased at the KIC
gbvalue above 1.9 (MPa·m1/2).
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference4 articles.
1. K. Kawasaki: Bull. Ceram. Soc. Jpn., Vol. 39 (2004), p.692.
2. A. Krell, J. Woltersdrf, E. Pippel and D. Shulze: PHILOSOPHICAL MAGAZINE A(1985) p.765.
3. [1] [2] [3] [4] [5] [6] - 2 - 1 0 1 2 ln (K IC gb ) ln N - lnP - 0. 5 lnd 0. 5 1 1. 5 2 2. 5 K IC gb ( MPa � m 1/2 ) I II.
4. [1] [2] [3] [4] [5] [6] - 2 - 1 0 1 2 ln (K IC gb ) ln N - lnP - 0. 5 lnd 0. 5 1 1. 5 2 2. 5 K IC gb ( MPa � m 1/2 ) I II.