Plastic Dissipation and Temperature Field around a Steady Running Crack

Author:

Luo Wen Bo1,Yang Ting Qing2

Affiliation:

1. University of Science and Technology Beijing

2. Huazhong University of Science and Technology

Abstract

Temperature field is formed due to heat dissipation when material is subjected to irreversible deformation. In this paper, the heat dissipation in the crack-tip plastic zone was considered. By considering the propagating crack-tip plastic zone as a running heat source and constructing a reasonable heat source density distribution function, the temperature field around a steady running crack was obtained. It is shown that temperature rise is dependent on the crack growth speed and the material parameters. The maximum temperature rise reaches to >50 oC in our example calculations for a steady running crack in PMMA.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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