Abstract
It is still an open problem how the thermal effect influences the fracture behavior of
piezoelectric materials especially under cycling electrical loading. Experimental observations have found that the fracture toughness of piezoelectric solids under electric loading may be greatly different from that under mechanical loading. A pronounced rise of temperature may be caused either by mechanical or by electric loading. In this paper, the thermal effects and energy dissipation mechanism in cracked piezoelectric materials under cyclic-electric-loading have been studied. The
temperature rise is derived under the assumption of decoupling between thermal and
electromechanical fields and the influences of frequency and the shape of electric wave on the temperature rise are quantitatively analyzed.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献