Fabrication of Microstructures by Means of Electrophoretic Deposition (EPD)

Author:

Zeiner Johannes1,Clasen Rolf1

Affiliation:

1. Saarland University

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference9 articles.

1. M. Thome, G. Hirt and B. Rattay, Metal Flow and Die Filling in Coining of Micro Structures with and without Flash. Advanced Materials Research 6-8 (2005) 631-638.

2. G. Hirt and B. Rattay, Metal Flow and Die Filling in Coining of thin Sheets with large Plastic Strains. Proceedings of Materials Week, (2001), Munich, Germany. Paper No. 443 G3.

3. R. Clasen and J. Tabellion, Electrophoretic deposition from aqueous suspensions - technical applications, in: Electrophoretic Deposition: Fundamentals and Applications, A. R. Boccaccini, O. v. d. Biest and J. B. Talbot, Editor. (2002).

4. M. v. Smoluchowski, Elektrische Endosmose und Strömungsströme, in: Handbuch der Elektrizität und des Magnetismus, L. Graetz, Editor. (1921), Leipzig. pp.366-387.

5. R. Clasen, Forming of compacts of submicron silica particles by electrophoretic deposition. 2nd Int. Conf. on Powder Processing Science, ed. H. Hausner, G. L. Messing and S. Hirano. (1988).

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