CFD Optimization of Design for IGBT Air-Cooled Heat Sink

Abstract

Power dissipation problems for Insulated Gate Bipolar Transistor (IGBT) are requiring increasingly complex design solutions. While designs that are more efficient make thermal management possible, current systems still require CFD methods for dissipating heat. Parameter optimization of the air-cooled heat sink is carried out to cool a three-chip, 2400w IGBT plate. The parameters are compared using maximum junction temperature and fan efficiency.